391
FERRITE
PRODUCTS
5
CMKRA/BUKRA
11.Solderability
12.Resistance to Soldering Heat
13.Thermal Shock
14.Damp Heat (steady state)
15.Loading under Damp Heat
At least 75% of terminal electrode is
covered by new solder.
Appearance: No abnormality
Inductance change: Within M15%
Appearance: No abnormality
Inductance change: Within M15%
CMKRB
Solder shall be
uniformly adhered
onto immersed
surfaces.
Inductance
change: Within
M
5%
Inductance
change: Within
M
15%
Inductance change:
Within M15%
Withstanding
voltage: No
abnormality
Insulation
resistance: No
abnormality
TLF9U,TLF12U
Solder shall be
uniformly adhered
onto immersed
surfaces.
Inductance
change: Within
M
5%
Inductance
change: Within
M
15%
Inductance change:
Within M15%
Withstanding voltage:
No abnormality
Insulation resis-
tance: No abnor-
mality
TLF25RA
Appearance: No abnormality
Inductance change: Within M15%
Specified Value
Item
Test Methods and Remarks
2/3
RELIABILITY DATA
BBB
COMMON MODE CHOKE COIL fFOR AC, DC LINESg
CMKRA/BUKRA,CMKRB
Solder temperature: 235M5C
Duration: 2M0.5 sec.
Immersion depth: According to detailed specification.
TLF9U,TLF12U,TLF25RA
Solder temperature: 230M5C
Duration: 2M0.5 sec.
Immersion depth: Up to 1.0 to 1.5 mm from PCB mounted level.
CMKRA/BU
RA,CMKRB
Solder temperature: 260M5C
Duration: 5M0.5 sec.
Immersion depth: Up to 2V2.5mm from terminal root.
Recovery: 4V24 hrs of recovery under the standard condition after the test.
TLF9U,TLF12U,TLF25RA
Solder temperature: 260M5C
Duration: 5M1 sec.
Immersion depth: Up to 1.0 to 1.5 mm from PCB mounted level
Recovery: At least 1 hr of recovey under the standard
condition after the test, followed by the measurement within 2 hrs.
According to JIS C 0025
Conditions for 1 cycle
Step
Temperature(C)
Duration (min.)
1
K
25M3
30M3
2
Room temperature
Within 3
3
J
85M2
30M3
4
Room temperature
Within 3
Number of cycles: 10
Recovery: 4V24 hrs of recovery under the standard condition after the removal
from test chamber fCM-RAg
1V2 hrs of recovery under the standard condition after the removal
from test chamber fCM-RBg
TLF9U,TLF12U,TLF25RA
Temperature: 60M2C
Humidity: 90 to 95%
Duration: 500 hrs
Recovery: At least 1 hr of recovey under the standard condition after the re-
moval from test chamber, followed by the measurement within 2 hrs.
CMKRA/BUKRA,CMKRB
Temperature: 40M2C
Humidity: 90V95LRH
Duration: 500
hrs
Applied current: Rated current
Recovery: 4V24 hrs of recovery under the standard condition after the re-
moved from test chamber fCM-RAg
1V2 hrs of recovery under the standard condition after the re-
moved from test chamber fCM-RBg
TLF9U,TLF12U,TLF25RA
Temperature: 60M2C
Humidity: 90 to 95%
Duration: 100 hrs
Applied voltage: Apply the following specified voltage between windings.
TLF9UA,12UA,12UB, 25RA
250 VAC
TLF9UB
50 VDC
Recovery: At least 1 hr of recovey under the standard condition after the re-
moval from test chamber, followed by the measurement within 2 hrs.
J
12
K
0
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